CTLTVS12 TR PBFREE

CTLTVS12 w w w. c e n t r a l s e m i . c o m SURFACE MOUNT SILICON UNI-DIRECTIONAL TRANSIENT VOLTAGE SUPPRESSOR DESCRIPTION: The CENTRAL SEMICONDUCTOR CTLTVS12 is a low leakage, fast response TVS packaged in an ultra small, ultra low profile surface mount package. This device is designed to protect sensitive equipment against ESD damage. MARKING CODE: O TLM2D3D6 CASE APPLICATIONS: • PDAs • Memory Card Ports • Cellular Phones • Instrumentation FEATURES: • Ultra Small, Ultra Low Profile 0.3mm x 0.6mm x 0.3mm Leadless Surface Mount package • Low Capacitance • Low Leakage Current MAXIMUM RATINGS: (TA=25°C) Peak Power Dissipation (8x20μs) SYMBOL PPK Electrical Fast Transient (IEC 61000-4-4) (5x50ns) EFT 40 A VESD VESD 30 kV 30 kV TJ, Tstg -55 to +150 °C ESD Voltage (IEC 61000-4-2, Air) ESD Voltage (IEC 61000-4-2, Contact) Operating and Storage Junction Temperature UNITS W 35 ELECTRICAL CHARACTERISTICS: (TA=25°C) VF=1.0V MAX @ IF=10mA Maximum Reverse Stand-off Voltage VRWM V 9.0 Breakdown Voltage Test Current VBR @ IT MIN NOM MAX V V V IT Maximum Reverse Leakage Current IR @ VRWM mA μA V A 5.0 1.0 18 1.8 10 12 14 Maximum Clamping Voltage (8x20μs) VC @ IPP Typical Typical Typical Typical TLP Clamping Dynamic Junction Junction Voltage Resistance Capacitance Capacitance (Note 1) (Note 1) @ 0V Bias @ 9V Bias VCL @ IPP RDYN CJ CJ V A 6.0 6.0 11 13 Ω pF pF 0.71 14 5.0 Note 1: Transmission Line Pulse (TLP) conditions: Z0=50Ω, tp=100ns R3 (23-October 2015) CTLTVS12 SURFACE MOUNT SILICON UNI-DIRECTIONAL TRANSIENT VOLTAGE SUPPRESSOR TLM2D3D6 CASE - MECHANICAL OUTLINE LEAD CODE: 1) Cathode 2) Anode MARKING CODE: O R3 (23-October 2015) w w w. c e n t r a l s e m i . c o m CTLTVS12 SURFACE MOUNT SILICON UNI-DIRECTIONAL TRANSIENT VOLTAGE SUPPRESSOR TYPICAL ELECTRICAL CHARACTERISTICS R3 (23-October 2015) w w w. c e n t r a l s e m i . c o m CTLTVS12 SURFACE MOUNT SILICON UNI-DIRECTIONAL TRANSIENT VOLTAGE SUPPRESSOR TYPICAL ELECTRICAL CHARACTERISTICS R3 (23-October 2015) w w w. c e n t r a l s e m i . c o m OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time. • Supply management (Customer portals) • Custom bar coding for shipments • Inventory bonding • Custom product packing • Consolidated shipping options DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask. • Free quick ship samples (2nd day air) • Special wafer diffusions • Online technical data and parametric search • PbSn plating options • SPICE models • Package details • Custom electrical curves • Application notes • Environmental regulation compliance • Application and design sample kits • Customer specific screening • Custom product and package development • Up-screening capabilities REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms w w w. c e n t r a l s e m i . c o m (001)